The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 1990
Filed:
Oct. 01, 1987
Marzio Fusaroli, Milan, IT;
Abstract
An integrated circuit package is described that provides increased heat dissipation of heat generated in an integrated circuit chip that can be positioned within the package. This increased heat dissipation characteristic is achieved by configuring enlarged metal areas of the lead frame of the package that are extensions of the flag area. The flag area is the portion of the lead frame to which the integrated circuit chip is mounted in the assembly of the semiconductor package. The increased lead frame area provides increased contact with the package housing and provides a thermal conduction path in close proximity to the exterior surface of the package housing. The integrated circuit chip has a more efficient thermal path to the ambient air thermal heat sink.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile