Pin transfer adhesive application for surface mount component processes

Abstract

A glue plate module automatically establishes layers of adhesives thereon periodically interposed between an upper pin plate and a lower lift plate. The pin plate carries a plurality of pendantly disposed and releaseable transfer pins arranged on the plate in a pattern corresponding to that of a desired adhesive dot pattern to be placed on a component board. The pins momentarily contact the adhesive layer to receive adhesive dots. The lift plate supports a circuit board to be populated with the adhesive dot pattern. Means are provided to periodically move the pin plate and lift plate together in momentary contact whereby the adhesive dots carried by the pins are transferred to the board surface in the desired pattern. Conveyor means positioned virgin board onto the lift plate prior to adhesive transfer and remove the boards thereafter. Means are provided to compensate for non-uniform distances between pins and correlative board locations receiving adhesive dots caused by board warpage or the like. In one embodiment momentary opposing clamping forces are disposed across the board surface on either side to flatten the board prior to adehsive dot deposition. The pins include spring members providing compliance to further compensate for irregularities in pin-board separation. Appropriate spacing of pins and means providing the clamping forces facilitates adhesive transfer to boards pre-populated with components on one or both sides.