The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 1990
Filed:
Oct. 28, 1988
Denis J Leveque, Milwaukee, WI (US);
Neil A Czarnecki, Mukwonago, WI (US);
Eaton Corporation, Cleveland, OH (US);
Abstract
A printed circuit is formed by conventional methods over an adhesive coating applied to a flexible high temperature withstandability disposable backing to form a flexible laminate which is positioned in a cavity of an injection mold to conform to surface variations. The printed circuit conductors are surrounded on three sides by molten plastic material injected into the mold cavity to embed the conductors in the respective surfaces of the molded plastic article, which surfaces are non-coplanar and adjoining and the conductors are continuous from one surface to the other. The bond strength of the adhesive is preferably high with regard to the backing and low with regard to the printed circuit conductors to permit adhesive and backing to be peeled away after molding, thereby providing a three diemensional printed circuit in, for example, a recessed area of a molded plastic housing part of electrical apparatus.