The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 1990
Filed:
Aug. 18, 1989
Robert A Boudreau, Hampton, NH (US);
Joanne S LaCourse, Hudson, MA (US);
GTE Laboratories Incorporated, Waltham, MA (US);
Abstract
A localized cooling method allows the sequential alignment and soldering of one optical fiber at a time to a semiconductor package, while previously aligned and soldered optical fibers are held fixed. This method utilizes the mechanical property of a sharp melting point eutectic alloy solder or a pure metal solder for the fiber connections and is effective for multi-fiber optoelectronic packages demanding stability and high precision. A package design for optoelectronic components requiring multi-fiber alignment incorporates this feature of localized cooling internally. The localized cooling method and the novel package utilizing this method internally make it possible to eliminate the tilted angle optical fiber alignment problem by mounting tilted facet optical amplifier components at a predetermined offset angle.