The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 1990
Filed:
Dec. 23, 1988
Roger L Frick, Chanhassen, MN (US);
Stanley E Rud, Jr, Eden Prairie, MN (US);
Rosemount Inc., Eden Prairie, MN (US);
Abstract
A pressure sensor utilizes the effect of different elastic moduli between layers or sections of different material that are bonded together to form a body, so that when the bonded material unit is subjected to a uniform hydrostatic external pressure, the differences in the elastic moduli of each of the materials will cause the materials to deflect in a predictable manner proportional to pressure. The amount of warpage or deflection of the body of material can be measured as a function of pressure. Specifically, two layers of materials, such as silicon and borosilicate glass, which have substantially different elastic moduli can be bonded across an interface surface to form an assembly, and when subjected to a substantially uniform pressure on the exterior surfaces the assembly will deflect for indicating applied pressure at relatively high pressure ranges. The bonded material assembly is placed in a fluid to provide a substantially uniform applied hydrostatic pressure on all exposed surfaces of the bonded material assembly.