The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 1990
Filed:
Oct. 20, 1988
Klaus D Weiswurm, San Antonio, TX (US);
Other;
Abstract
Method and apparatus for straightening the pins of a computer chip, logic or integrated circuit, or other type of semiconductor device having a pin grid array (16). The apparatus includes a rotating turret (28) for positioning the pin grid array (16) at a plurality of stations (20) and (22) for performing a series of straightening operations to the pins (18) at each station, first and second rakes (110) and (110.sup.2), each of the rakes (110 and 110.sup.2) having a plurality of tines (112) extending therefrom for insertion between the pins (18) of the pin grid array (16) in first and second directions, a jig (136) having a plurality of holes (146) therein for receiving the pins (18) when the jig (136) is moved toward the wafer (40) of the pin grid array (16) to straigthen the pins (18), and appropriate controls for advancing the pin grid array (16) positioned in the turret (28) from one station to another and controlling the insertion of the tines (112) of the first and second rakes (110) and (110.sup.2), the raising and lowering of the rakes (110) and (110.sup.2) and the jig (136), and activating the mechanisms for loading and unloading the pin grid array (16) into the turret (28). The method includes the steps of raking the pins (18) of the pin grid array (16) in a first direction, raking the pins (18) in a second direction, and then finely straightening the pins (18) by moving a jig (136) having a plurality of holes (146) therein for receiving the pins (18) toward the wafer (40).