The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 1990
Filed:
Aug. 09, 1988
Applicant:
Inventors:
Alexander A Bosna, Malvern, PA (US);
Louis M Riccio, DeVault, PA (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05B / ; B05D / ;
U.S. Cl.
CPC ...
428158 ; 427 531 ; 427 96 ; 427275 ; 427307 ; 427422 ; 427423 ; 428901 ;
Abstract
A method of making printed circuit boards, particularly 3-Dimensional circuit boards, wherein a surface layer of micron sized hollow spheres, beads or spacers are ruptured or fractured in a pattern defining the electrical circuit. The circuit pattern is thermally sprayed with molten copper particles. The molten copper particles shape themselves to the nooks, crannies and undercuts of the fractured spheres or beads to mechanically lock the electrical circuitry to the board. The current carrying capacity can be adjusted by the thickness of the sprayed metal. The overspray does not adhere to smooth non porous surfaces adjacent the fractured spheres or beads.