The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 1990

Filed:

Aug. 29, 1989
Applicant:
Inventors:

Stanley S Chang, Palos Verdes Estates, CA (US);

Flora Yeung, Agoura Hills, CA (US);

Assignee:

Hughes Aircraft Company, Los Angeles, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
2191216 ; 29600 ; 21912185 ; 2191218 ; 21912169 ; 343756 ; 343840 ; 343909 ;
Abstract

A method of fabricating a polarizing dish antenna reflector (10) wherein a light source (22) is employed to pyrolyze an organometallic compound (14) disposed on the antenna surface to form grid elements (24) directly thereon. The surface of the parabolic dish antenna reflector (10) is coated with an organometallic compound (14) that comprises a metallic component such as gold, silver, copper chrome, or other suitable metal. The coated surface may be conditioned by depositing a surface film of polyimide, or the like. The coated surface is then pyrolyzed by using a high intensity focussed light source (22), such as a laser or discharge lamp to form metal grid lines (24) on the surface. The light source (22) is scanned across the surface to create parallel scan lines, or the light source may be fixed and the reflector surface can be moved relative to the light source (22) using a computer controlled XY table (16), or the like. The focussed light pyrolyzes the organometallic compound (14) and volatilizes the organic portion thereof, leaving metal traces disposed on the reflector surface. Once all the grid lines are formed, the reflector (10) is rinsed in appropriate solvents to remove excess organometallic compound.


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