The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 1990

Filed:

Mar. 27, 1989
Applicant:
Inventors:

Hisashi Watanabe, Kisarazu, JP;

Seiji Satou, Kimitsu, JP;

Akira Tokumitsu, Kimitsu, JP;

Kazuya Miyamoto, Kimitsu, JP;

Haruhiko Aoi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428209 ; 428212 ; 428457 ; 428458 ; 4284735 ; 428901 ; 174254 ; 361397 ; 361398 ;
Abstract

Flexible printed circuit base materials of this invention are composed of at least one layer of polyimide resins of low thermal expansion, at least one layer of polyimide resins of high thermal expansion with a higher linear expansion coefficient than that of the foregoing polyimide resins, and at least one layer of a conductor, highly reliable in dimensional stability to temperature changes, adhesive strength, and flatness after the etching, easy to work with in protection of the circuits made by etching.


Find Patent Forward Citations

Watanabe, Hisashi. (1990). Flexible base materials for printed circuits (U.S. Patent No. 4937133). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4937133

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…