The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 1990

Filed:

Oct. 04, 1989
Applicant:
Inventors:

Yoshikuni Maruyama, Sayama, JP;

Hiroshi Itoh, Sayama, JP;

Kesao Taguchi, Sayama, JP;

Terumi Nagao, Sayama, JP;

Toshiki Takeda, Sayama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
156245 ; 156330 ; 1563309 ; 1563317 ; 264 464 ; 264 467 ; 2643281 ; 2491141 ; 249115 ;
Abstract

A process for producing a urethane die. A heat-resistant epoxy adhesive is applied to the inner surface of a recess provided in the body of a die. A urethane primer is applied to the adhesive while the adhesive is still in a semi-hardened state. A punch is inserted into the recess to form a space between the recess and the punch and a urethane resin is injected into the space to form a resin layer on the recess having a shape corresponding to the outer surface of the punch. A reinforcing fibrous material may be incorporated into the resin layer by applying a urethane resin having a lubricant incorporated therein to the surface of the punch and adhering a fibrous material impregnated with the urethane resin to the coated surface of the punch prior to inserting the punch into the recess. d


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