The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 1990
Filed:
Mar. 20, 1989
Applicant:
Inventors:
Yukinori Sakumoto, Shizuoka, JP;
Atsushi Koshimura, Shizuoka, JP;
Hiroshi Matsushita, Shizuoka, JP;
Masaki Tsushima, Shizuoka, JP;
Assignee:
Tomoegawa Paper Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ;
U.S. Cl.
CPC ...
428 40 ; 428355 ; 428906 ; 525438 ; 252511 ;
Abstract
An adhesive tape for die bonding is disclosed, comprising a continuous tape wound on a reel, the continuous tape having a structure that an adhesive layer composed mainly of a filler and a binder comprised of an epoxy resin and a polyester resin is laminated on a release film. According to the adhesive tape for die bonding of the invention, bonding of semiconductor elements can be attained with good workability and high reliability by very easily handling of the adhesive tape.