Ceramic cased capacitor

Abstract

A ceramic cased capacitor and related method of construction are provided, wherein the capacitor is substantially impervious to moisture penetration and is adapted for attachment to conductive leads with superior lead pull strength. The capacitor comprises at least two conductive plates encased at a selected gap within a substantially monolithic casing of selected dielectric material such as a ceramic material. The plates each include a tab projecting beyond an adjacent margin of the other plate. Recessed seats are formed in the casing as by drilling to bridge at least partially into the tabs. Conductive lead ends are attached to the capacitor by soldering within the recessed seats, thereby securely anchoring the leads in a manner substantially impervious to moisture penetration. The thus-formed capacitor may be used in a wide range of electronic circuit applications without requiring a conventional encapsulating outer jacket or coating of insulating material. By virtue of omission of the encapsulating jacket, the capacitor can be used in high temperature environments, and/or in high voltage applications, without concern for jacket deterioration, deterioration in insulation resistance, or delamination of the jacket relative to the monolithic casing.