The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 1990
Filed:
Apr. 12, 1988
Applicant:
Inventors:
Candice H Brown, San Jose, CA (US);
Homi Fatemi, Cupertino, CA (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 72 ; 357 81 ; 357 67 ;
Abstract
The invention discloses an improved integrated circuit package having enhanced thermal conductivity comprising a molding or encapsulation resin having a semiconductor filler material. In a preferred embodiment, the semiconductor filler material comprises a high purity doped semiconductor to reduce alpha errors caused by alpha emisison normally caused by the use of fillers containing trace amounts of radioactive impurities and to provide enhanced thermal conductivity.