Polyimide and high-temperature adhesive thereof

Abstract

This invention relates to a novel polyimide which is high-temperature resistant and capable of being molded in a fused state. This invention also relates to a high-temperature adhesive using the polyimide. The polyimide consists essentially of recurring units of the formula: ##STR1## where R is a tetra-valent radical selected from the group consisting of an aliphatic radical having 2 or more carbon atoms, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, and non-condensed polyaromatic radical wherein aromatic radicals are linked to one another directly or via a bridge member. The polyimide can be prepared by reacting bis[4-(4-aminophenoxy)phenoxy)phenyl] sulfone with a tetracarboxylic dianhydride in an organic solvent and imidizing the resultant polyamic acid. Various tetracarboxylic dianhydrides can be used and preferred dianhydride are pyromellitic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, bis(3,4-diarboxyphenyl) ether dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, and 4,4'-(p-phenylenedioxy)diphthalic dianhydride.