The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 1990

Filed:

Mar. 22, 1988
Applicant:
Inventors:

Takaji Takenaka, Hadano, JP;

Tositada Netsu, Hadano, JP;

Hidetaka Shigi, Hadano, JP;

Masakazu Yamamoto, Kodaira, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 75 ; 357 74 ; 357 80 ;
Abstract

In a pin grid array type multi-chip module structure comprised of a ceramic multi-layer wiring board having the top surface on which a plurality of semiconductor devices are carried, divisional board areas each having the same size are respectively allotted to individual semiconductor devices of the same type. Within respective divisional board areas, the positional relation between the array arrangement of connecting pads on the top surface for connection to the semiconductor devices and the array arrangement of I/O pins on the bottom surface of the board is so determined as to be constant. Metallized patterns inside the board which are to be connected power supply I/O pins and ground I/O pins are made constant for respective divisional board areas allotted to individual semiconductor devices of the same type.


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