The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 1990
Filed:
Oct. 04, 1988
Mitsuya Sato, Yokohama, JP;
Takao Ukaji, Yokohama, JP;
Nobuhito Yamaguchi, Yokohama, JP;
Taro Ohmori, Yokohama, JP;
Eiichi Murakami, Yokohama, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A wafer prober usable with a probe card for examination of chips formed on a wafer is disclosed. The wafer prober has a function for automatically aligning bonding pads of each chip with probe needles of the probe card. The prober includes a contact plate movable in X and Y directions with a wafer chuck. The contact blade is pressed against at least one of the tips of the probe needles, and the thus contacted needle tip is observed by a TV camera from the underneath of the contact plate. The video signal obtained thereby is used for the alignment between the bonding pads and the probe needles. Also, the TV camera is moved in the X and Y directions with the wafer chuck to allow that one and the same reference mark is observed by this TV camera and by another TV camera provided for image-taking the bonding pads. With the proposed structure, the bonding pads and the probe needles can be aligned automatically and accurately.