The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 1990
Filed:
Feb. 10, 1986
Michael J Pryor, Woodbridge, CT (US);
Julius C Fister, Hamden, CT (US);
Narendra N Singhdeo, New Haven, CT (US);
Deepak Mahulikar, Meriden, CT (US);
Satyam C Cherukuri, West Haven, CT (US);
Olin Corporation, New Haven, CT (US);
Abstract
A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component for dissipating thermal stresses is disposed between the substrate and the semiconductor die to dissipate stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed between the substrate and the die with a silver-tin sealing composition. A bonding material may be used alone to bond a die to a substrate and dissipate stresses from thermal cycling.