The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 1990

Filed:

Nov. 16, 1989
Applicant:
Inventor:

Shigeo Horii, Kyoto, JP;

Assignee:

Reiko Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B64B / ; B64B / ;
U.S. Cl.
CPC ...
244 31 ;
Abstract

The balloon according to the invention is formed by heat-sealing at least one heat-sealable sheet which comprises a plastic film and a metal vapor deposition layer formed on one side of the plastic film. The metal vapor deposition layer is discontinuously formed so that the sheet has a metallic but insulating surface. Resultantly, the balloon having a dielectric breakdown voltage of not less than 1000 V can be easily obtained. Preferably, the metal vapor deposition layer is formed in a state of islands in the sea, the size of the island being 200 .ANG. to 1 .mu.m and the interval between the islands being 100 .ANG. to 5000 .ANG..


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