The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 1990
Filed:
May. 26, 1988
Applicant:
Inventors:
Osamu Narimatsu, Nagoya, JP;
Michiyasu Ito, Kuwana, JP;
Kazuyoshi Komatsu, Nagoya, JP;
Yasuhiro Shibata, Nagoya, JP;
Assignee:
Mitsui Toatsu Chemicals, Incorporated, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
5128 / ; 51DI / ; 51DI / ;
Abstract
This invention provides a wafer processing film comprising a base film having a Shore D hardness of 40 or less and an adhesive layer disposed on one surface of the base film. In grinding the surfaces of wafers such as silicon and similar wafers, breakage can be prevented by affixing the wafers to the adhesive layer of the processing film and then grinding them.