The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 1990
Filed:
Feb. 22, 1988
Applicant:
Inventors:
Israel A Lesk, Phoenix, AZ (US);
Ronald E Thomas, Tempe, AZ (US);
George W Hawkins, Mesa, AZ (US);
James M Rugg, Tempe, AZ (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 72 ; 357 70 ; 357 52 ; 357 68 ;
Abstract
An improved semiconductor die for plastic encapsulated semiconductor devices which impedes the inherent delamination caused by the differing expansion coefficients of the semiconductor die and plastic encapsulation. Topological configurations are processed in the die corners of the semiconductor die which are void of circuitry. The topological configurations act as barriers and slow the delamination progression. This leaves the operational circuitry unaffected for an increased time thereby increasing device lifetime.