The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 1990

Filed:

May. 26, 1989
Applicant:
Inventor:

Gerhard W Poelzing, New Providence, NJ (US);

Assignee:

AT&T Bell Laboratories, Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ;
U.S. Cl.
CPC ...
26427217 ; 2643285 ; 26432817 ; 425812 ;
Abstract

In molding integrated circuit packages voids are found in the molded plastic due to air entrapped in the charging container. It was discovered that entrapped air can be avoided if a portion of the preheated charge material has a higher viscosity than the remainder. Conveniently, this is achieved by preheating the preforms in a temperature gradient and charging the hottest preforms last into the container. The pressure causes the material at the top of the chamber to flow first, thereby expelling unwanted air through the runners ahead of the plastic flow. An effective implementation results from tilting the RF electrode in the preheating apparatus.


Find Patent Forward Citations

Poelzing, Gerhard. (1990). Method for encapsulating integrated circuits (U.S. Patent No. 4927590). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4927590

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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