The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 1990
Filed:
Dec. 14, 1988
Kazuhiko Nasu, Osaka, JP;
Kazuei Kenmochi, Osaka, JP;
Tomohiko Niikawa, Osaka, JP;
Atsushi Matsui, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A method for manufacturing an electronic device having therein a lead frame and a vibration-generating element integrally provided on the lead frame. The lead frame and the element are first provided in a metallic mold assembly comprising an upper mold portion and a lower mold portion, the upper and lower mold portions respectively having recess portions so as to form a cavity when the upper and lower mold portions are assembled with each other. A first sealing material is injected into the cavity so that the element is covered by the injected first sealing material, the first sealing material having a shrinkage property and a low adhesion property. After solidification of the injected first sealing material, they are removed from the mold assembly and then immersed in a second sealing material at a vacuum state so that the second sealing material is impregnated between the first sealing material portion and the lead frame. The second sealing material impregnated therebetween is hardened so as to seal a gap formed therebetween.