The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 1990
Filed:
Dec. 21, 1988
Rene Septfons, Paris, FR;
Societe Anonyme dite: Alcatel CIT, Paris, FR;
Abstract
The invention relates to cooling integrated circuit packages (14) for surface mounting in a hybrid circuit. The invention provides a cooling method which consists in soldering the bottom of the integrated circuit package (14) to one side of the hybrid circuit substrate (10) and in soldering a heat-dissipating peg (30) to its other side. In order to do this, the bottom of the package is provided with a tinnable area and the substrate (10) is provided with two overlying tinnable areas on opposite faces thereof, said areas being put into communication with each other by at least one plated-through hole (31). The peg (30) is pierced by a channel terminating in a capillary which opens out adjacent to the substrate and which leads to at least one solder receptacle (64, 67) opening out into a side wall of the peg, said channel serving to absorb any excess solder from beneath the bottom of the integrated circuit package (14) which might otherwise give rise to short circuiting solder bridges between connection pads or else prevent the integrated circuit package (14) from being pressed adequately against the substrate (10).