The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 1990
Filed:
Dec. 05, 1988
Taizo Eshima, Fukuoka, JP;
Yasuyoshi Kai, Fukuoka, JP;
Abstract
A lead forming apparatus suitable for use in forming the leads of a semiconductor device is disclosed. The apparatus has a housing for supporting a stationary lower mold half, a support plate arranged to freely move with respect to the housing for supporting a movable mold half in opposition to the lower mold half, a moving device for moving the support plate to cause the movable mold half toward and away from the lower mold half, and an adjusting device for adjusting the position of the support plate with respect to the moving device. The moving device has a crankshaft, a driving device for rotating the crankshaft about its axis, and a coupler transmitting the rotation of the crankshaft to the support plate as a linear motion. The apparatus having the above-described arrangement can be operated with a reduced noise level and a reduced impact and, furthermore, achieves good operability.