The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 1990
Filed:
Dec. 29, 1988
John S Walker, Scottsdale, AZ (US);
Scott E Jenkins, Phoenix, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
An origami printed circuit board comprises a rigid printed circuit board having a flexible conducting back secured to the bottom of the circuit board. The flexible back is constructed of alternating layers of flexible dielectric and conducting layers bonded together, where the conducting layers may include copper. The circuit board is then grooved in a predetermined manner with the grooves extending through the rigid circuit board, but not extending into the flexible conducting back. The entire circuit board/flexible back is then folded along the grooves in origami fashion to form an enclosure, or other designed shape, with the flexible back forming the outer walls of the shape. By coupling the electronic elements of the circuit board to the conducting layers of the flexible back, the flexible conducting back includes electronic circuit printed interconnections on the rigid board. A bottom conducting layer of the flexible back may be uncoupled to the electronic elements of the circuit board. When the origami printed circuit board is folded into shape, the bottom layer forms the board's outer wall and creates an EMI/TEMPEST shield. The shield also isolates RF frequency emissions.