The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 1990
Filed:
Jul. 01, 1988
Applicant:
Inventors:
Herbert Stopper, Orchard Lake, MI (US);
Cornelius C Perkins, Birmingham, MI (US);
Assignee:
Mosaic Systems, Inc., Troy, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361398 ; 361401 ; 357 80 ; 174 524 ;
Abstract
Disclosed is a wafer scale device 10, 201 on which is formed a layer of thin film as an interconnection system 203 with contact sites 202, 207 between the interconnection system 203 and die bonding sites 202 of the wafer 10, 201 to form a monolithic wafer. The interconnection system 203 has bonding sites on the surface of the wafer 10, 201 to which chips 11 are bonded to form a hybrid monolithic wafer system. The wafer 10 is packaged within a wafer package, FIG. 4, and the packaging system utilizes a header 20 which is a flexible circuit connector between the wafer package and first level circuit board 30.