The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 1990
Filed:
Oct. 26, 1988
Satoru Kitta, Nagano, JP;
Fujikoshi Machinery Corporation, Nagano, JP;
Abstract
In an apparatus for lapping a wafer material, e.g., a semiconductor silicon wafer, by bonding the wafer to the lower surface of a pressing plate, mounting the pressing plate on a turn table to bring the wafer into contact with the turn table and pressing the pressing plate downwardly with a downwardly opening cup-like top ring mounted thereon, the pressing plate is pressed down not directly with the top ring alone but pressed through a rubber membrane covering the downward opening of the top ring and pressurized with compressed air under pressure regulation so that the lapping pressure on the wafer surface can be very uniform and the thus lapped wafer is excellent in respect of the flatness of each lapped surface and parallelism between lapped surfaces.