The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 1990
Filed:
Feb. 01, 1985
Candice H Brown, San Jose, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A metal lead frame for an integrated circuit package is disclosed having stress relieving means formed therein to inhibit breakage of a thermally mismatched silicon die subsequently attached thereto and then heated during normal operation of the device. The stress relieving means may comprise parallel grooves formed in one or both surfaces of the central portion of the lead frame where a silicon integrated circuit die will subsequently be bonded to the lead frame. Preferably, the grooves are formed in both axes comprising the plane of the lead frame and may be formed on both surfaces of the lead frame. The stress relieving means may also comprise a series of openings cut through the central portion of the lead frame.