Dielectric aperture assembly and method for fabricating the same

Abstract

A fabricated dielectric aperture assembly includes a first layer of electrically conductive material having an opening therethrough to define a first aperture, a second layer of electrically conductive material spaced from the first electrically conductive layer and having an opening therethrough to define a second aperture and a plurality of solid dielectric layers interposed between the first and second layers of electrically conductive material. The first and second layers of electrically conductive material with the multiple layers of dielectric material interposed therebetween form a generally laminar assembly. A grid-like structure is embedded in the laminar assembly and extends between the first and second electrically conductive layers. The grid-like structure has an inner wall, an outer wall portion, an interior bounded by the inner wall and a plurality of openings extending from the inner wall to the outer wall. The grid-like structure has a body portion embedded in the plurality of layers of solid dielectric material, a first end portion embedded in the first electrically layer in surrounding relation with the first aperture and a second end portion embedded in the second electrically conductive layer in surrounding relation with the second aperture. The grid-like structure defines a waveguide for providing an Rf signal transmission path through the portion of each layer of dielectric material positioned in the interior portion of the waveguide between the first and second apertures.