The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 1990

Filed:

Oct. 30, 1987
Applicant:
Inventors:

Erno Gyarmati, Julich, DE;

Xiliang Qiu, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B / ;
U.S. Cl.
CPC ...
264 60 ; 264 62 ; 264332 ;
Abstract

For joining shaped bodies of silicon nitride together, silicon nitride surfaces to be joined are first polished and then put into an apparatus for applying sputtered layers where they are first cleaned by ion bombardment in argon, followed immediately by sputtering with silicon in a nitrogen atmosphere such that a layer is deposited having a nitrogen content exceeding the Si.sub.3 N.sub.4 stoichiometric ratio. This readily provides a layer of the composition Si.sub.3 N.sub.5.5. A complementary nitrogen deficient layer is also provided in the joint before hot pressing, either in the form of a silicon layer that goes between the nitrogen-rich silicon nitride layers or in the form of a nitrogen-deficient silicon nitride layer sputtered onto a polished silicon nitride surface at relatively low nitrogen pressure. The parts are isostatically hot pressed together at 1500.degree. to 1750.degree. C. in a nitrogen atmosphere. The layers which are usually thinner than 1 .mu.m interact, with the disappearance of excess nitrogen and silicon, so that once the joint is produced all traces of jointure tend to disappear. The presence of a small amount of Y.sub.2 O.sub.3 at the joint has a favorable effect.


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