The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 1990
Filed:
Dec. 01, 1988
Applicant:
Inventor:
James Pollacek, Corvallis, OR (US);
Assignee:
Hewlett-Packard Company, Palo Alto, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
228110 ; 228118 ; 2281802 ;
Abstract
A tape automated bonding method and structure is disclosed. Interconnection using prepatterned metal beam tape interconnect is accomplished by providing vias in passivation layers overlaying a metal region in or on the major surface of the device which is to receive the interconnect leads, eliminating the requirement for bonding pad bumps. Ultrasonic pressure is applied to the beams as they superpose the vias, bonding each lead to its respective metal region.