The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 1990
Filed:
Sep. 17, 1987
John M Butler, Centerville, OH (US);
Richard P Chartoff, Cincinnati, OH (US);
James A Harvey, Kettering, OH (US);
University of Dayton, Dayton, OH (US);
Abstract
The present invention provides an epoxy resin of the formula ##STR1## where A is selected from the group consisting of --C(CH.sub.3).sub.2 --, --C(CF.sub.3).sub.2 --, --S--, --SO.sub.2 --, --CH.sub.2 --, --CO--, --O--, and --C.sub.3 H.sub.6 --, and each B.sub.1, B.sub.2, B.sub.3, and B.sub.4 is independently selected from the group consisting of --H, --F, --Cl, --Br, --I, --CH.sub.2 CH.dbd.CH.sub.2, --CH.sub.3, --C.sub.2 H.sub.5, --C.sub.3 H.sub.7, and --C.sub.4 H.sub.9. The present invention also provides a curable composition comprising an epoxy resin of the foregoing formula (I) and an effective curing amount of a hardener for an epoxy resin. The moisture sensitivity of the cured castings and/or composites based on the epoxy resins is lower than known epoxy resin castings and/or composites that have comparable thermal stability, modulus, strength, processability, and toughness.