The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 1990
Filed:
Jul. 06, 1988
Hitachi Construction Machinery, Co., Ltd., Tokyo, JP;
Abstract
The present invention provides an ultrasonic method for measuring the size of a possible flaw in a solid mass, in which an ultrasound is transmitted perpendicularly to the searching surface of a solid mass being the object under measurement through a liquid, a ratio in sound pressure between a reflected wave of the ultrasound from the surface of the solid mass and a reflected wave from any flaw in the solid, and a distance from the surface of the solid mass to the flaw, derived from the difference in time of reception between the reflected wave from the surface of the solid mass and the reflected wave from the flaw in the solid mass, are taken as indices of evaluation, and these indices of evaluation are compared with a reference value obtained beforehand by measuring a test piece made of a same material as that of the solid mass, thereby determining the size of the flaw. So, it is possible, with the present invention, to measure easily, very rapidly, accurately, quantitatively and non-destructively the size of a possible flaw in the parts or members composing any electrical or mechanical equipment.