The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 1990
Filed:
May. 04, 1988
Furukawa Electric Co., Ltd., Tokyo, JP;
Abstract
A method of press-molding defectiveness detection adapted for the detection of the press-bonding defectiveness of a terminal which is attached to the end of a covered wire so that a wire barrel and an insulation barrel of the terminal are press-bonded to a conductor portion at the end of the covered wire and a covered portion of the wire, respectively, by press-molding. A profile of a press-bonding load acting on the terminal during terminal press-bonding operation is detected, and the press-bonding defectiveness of the terminal is determined by comparing the detected press-bonding load profile with a reference press-bonding load profile. The press-bonding defectiveness of the terminal may be determined, as required, by comparing the integral value of the press-bonding load, calculated on the basis of the detected press-bonding load profile, with a predetermined reference value. Alternatively, the defectiveness may be determined by comparing a press-bonding load value at at least one point of time and the maximum press-bonding load value with predetermined reference values individually corresponding thereto. Preferably, the press-bonding defectiveness of the terminal is determined by separately detecting profiles of press-bonding loads acting on the wire barrel and the insulation barrel, and comparing these profiles with reference press-bonding load profiles individually corresponding thereto.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile