The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 1990
Filed:
Jul. 13, 1988
Morris Anschel, Binghamton, NY (US);
Bahgat G Sammakia, Johnson City, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention's semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package's heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficients of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar, around 2 to 5 ppm/degree Kelvin (.times.10.sup.-6 m/m degrees Kelvin), in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.