The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 1990
Filed:
Oct. 31, 1988
Kiyoshi Kawaguchi, Yokohama, JP;
Hideki Yagishi, Yokohama, JP;
Toyo Seikan Kaisha, Ltd., Tokyo, JP;
Abstract
A method of compression molding of a synthetic resin material in the heat-melted state by the cooperative action of a male mold assembly and a female mold assembly. The female mold assembly includes an outside member having a central opening and an inside member movable relative to the outside member through the central opening. A pre-mold-closing step of moving the outside member to a predetermined closed position is carried out, and thereafter, a compression molding step of moving the inside member to a predetermined closed position and compressing the synthetic resin material is carried out. Also provided is a synthetic resin feeding apparatus including an extruder having an extrusion plate with an extrusion opening formed therein and a cutting tool for cutting the synthetic resin in the heat-melted state extruded from the extrusion opening. A tapered portion is formed in the extrusion plate, and the extrusion opening is opened to the front end surface of the tapered portion.