The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 1990
Filed:
Mar. 08, 1989
Applicant:
Inventor:
Masaharu Yoshida, Fukuoka, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
228103 ; 228105 ; 2281802 ; 228-62 ; 228-9 ; 269903 ; 221155 ; 221163 ; 221167 ;
Abstract
Disclosed is a method for die bonding, comprising the steps of arranging a wafer having a multiplicity of mutually separated semiconductor chips vertically and near a lead frame which is conveyed horizontally, and picking up each of the semiconductor chips from the wafer and bonding the same onto the lead frame.