The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 1990
Filed:
Jun. 06, 1988
Samuel L Williams, Glassboro, NJ (US);
General Electric Company, Moorestown, NJ (US);
Abstract
A thick film, multi-layer interconnected circuit board includes a substrate of an electrical insulating material which will withstand high temperatures, such as alumina, having over a surface thereof a plurality of stacked layers of a glass dielectric. Between each pair of dielectric layers is a thick film conductor layer. The dielectric layers have openings or vias therethrough which are filled with a conductive material which makes electrical contact with the adjacent conductive layers. A contact pad is over the topmost dielectric layer and is electrically connected to a via conductor material in the topmost dielectric layer. The contact pad is of a thick film conductive material which is a layer of glass having particles of a conductive material, such as a noble metal or mixture of noble metals, dispersed therein. A bonding layer is between the contact pad and the topmost dielectric layer and is bonded to both. The bonding layer is of a mixture of the glass of the dielectric layers and the thick film conductive material of the contact pad.