The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 1990
Filed:
Aug. 26, 1988
Masakazu Kakimoto, Aichi, JP;
Ushio Co, Ltd., Aichi, JP;
Abstract
An apparatus for boring a laminated plate includes a table having a first surface on which a laminated plate may be placed for boring and an opposing second surface, the table defining at least one passage therethrough; a supporting pad for urging a laminated plate to be bored towards the first surface of the table; and a cutter for boring a laminated plate to be bored, the cutter operable to bore in a direction generally opposite to the direction that the supporting pad urges and through the passage defined by the table. Further according to the present invention, the cutter includes a knife edge, a pivotal mechanism adapted to be pivoted about its axial center line, and a stepping mechanism for moving the knife edge in one direction and unsuccessively further in a second direction so that successively deeper boring may be performed. Also according to the present invention, a boring cutter having an axial center line about which the cutter is operable to be rotated includes a cutting element having a modified round-bar shape. Still further, according to the present invention, a method of boring a multi-layer laminated plate includes the steps of pressing against the plate in one direction; and boring the the plate in a direction opposite to the direction in which it is pressed, the boring characterized in that a boring element is withdrawn between boring of each individual layer of the multi-layer plate.