The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 1990
Filed:
Apr. 07, 1988
Atsushi Morihara, Katsuta, JP;
Yoshio Naganuma, Hitachi, JP;
Shuntaro Koyama, Katsuta, JP;
Kazuji Yamada, Hitachi, JP;
Tasao Soga, Hitachi, JP;
Hideo Arakawa, Hitachi, JP;
Shunsuke Nogita, Hitachi, JP;
Yukio Hishinuma, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A heat conducting member is placed in the space between a semiconductor chip which generates heat and a heat transfer block which is cooled by a coolant, and the heat conducting member conducts heat from the semiconductor chip to the heat transfer block. The heat conducting member has a slanted surface which is inclined with respect to a surface to be cooled of the corresponding semiconductor chip. Even when the semiconductor chip is displaced or inclined with respect to the heat transfer block, the whole of the cooling surface of the semiconductor chip can be kept in contact with the corresponding heat conducting member.