The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 1990
Filed:
Oct. 06, 1987
Masanobu Kohara, Hyogo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
The electronic device relating to the invention is that in which an electrode is formed on the rear side surface of a semiconductor element, a circuit wiring and an external electrode connected electrically to one end of the circuit wiring are formed on the rear side surface of a flexible insulating film with a first opening provided therefor, a lead terminal overhanging to the first opening is connected electrically to the other end of the circuit wiring, a second opening is formed on the flexible insulating film so as to expose a part of the external electrode, a package substrate is constituted of the flexible insulating film in tape assembly system, the circuit wiring, the external electrode and the lead terminal, the semiconductor element is disposed on the rear side surface side of the flexible insulating film under the first opening and the lead terminal is connected electrically and mechanically thereto, a part or the whole of the semiconductor element, the electrode, the lead terminal, a part of the circuit wiring and the first opening are sealed with a sealing resin, a semiconductor device is constituted of the semiconductor element, the electrode, the package substrate and the sealing resin, the semiconductor device is mounted in a recession formed on the front side of a thin flexible substrate like IC card so as to make the front side surface of the flexible insulating film coincide with the front side surface of the thin flexible substrate.