The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 1990
Filed:
Oct. 13, 1988
Applicant:
Inventor:
Hirokazu Inoguchi, Fukushima, JP;
Assignee:
Nitto Boseki Co., Ltd., Fukushima, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428209 ; 428195 ; 428323 ; 428325 ; 428340 ; 428412 ; 428419 ; 428457 ; 428458 ; 428460 ; 428341 ; 4284735 ; 428901 ; 525 57 ; 525 61 ; 524557 ; 174256 ; 361397 ;
Abstract
There are disclosed (1) an injection-molded thermoplastic resin article having on a surface thereof a copper foil or a copper foil circuit, wherein the thermoplastic resin comprises one of polycarbonate, polyethersulfone, and polyetherimide and an adhesive layer comprising polyvinyl butyral having a degree of polymerization of up to 1000, polyvinyl formal having a degree of polymerization of up to 1000, or a mixture or both polymers is formed either the copper foil or the copper foil circuit and the molded thermoplastic resin and (2) a process for producing such injection-molded thermoplastic resin articles.