The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 1990
Filed:
Nov. 22, 1988
Applicant:
Inventors:
Yuji Okitsu, Tokyo, JP;
Koichi Machida, Yokohoma, JP;
Motoyuki Torikai, Yokohoma, JP;
Junko Tsuji, Oiso, JP;
Kotaro Asahina, Kamakura, JP;
Kazuya Shinkoda, Ninomiya, JP;
Takayuki Kubo, Yokohama, JP;
Mikio Kitahara, Yokohama, JP;
Assignee:
Mitsui Toatsu Chemicals, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ; C08L / ; C08K / ;
U.S. Cl.
CPC ...
523435 ; 523466 ; 525476 ;
Abstract
A semiconductor sealing resin composition which comprises (a) a modified epoxy resin which is a graft copolymer of a epoxy resin and a vinyl polymer having dispersed therein a silicone rubber with an average particle diameter less than 1.0.mu.; (b) a curing agent; and (c) an inorganic filler. The sealing composition has a low elastic modulus, a low heat expansion coefficient, a high resistance to heat and a high resistance to thermal expansion.