The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 1990
Filed:
Jan. 27, 1988
Richard Shyr, Greenlawn, NY (US);
General Instrument Corporation, New York, NY (US);
Abstract
A process for fabricating a multiplicity of semiconductor devices comprises the steps of applying electrodes to both faces of a semiconductor wafer, the mounting the semiconductor wafer to a substrate by means of an intervening layer of wax which bonds to the substrate and to the wafer. The wafer is then divided by grooves which extend through the wafer and at least partially through the layer of wax. The grooves are filled with a flexible resin that bonds to and passivates the edges of the chips, and the resin is subsequently cured. Next, the wax is removed from the cured resin and chips to provide a discrete flexible unit separate from the substrate. The discrete unit is divided into cells, each of which includes one of the chips for subsequent fabrication into a completed semiconductor device.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile