The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 1990
Filed:
Feb. 18, 1988
Applicant:
Inventors:
Katsuo Honda, Mitaka, JP;
Shuichi Tsukada, Mitaka, JP;
Assignee:
Tokyo Seimitus Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ; B28D / ;
U.S. Cl.
CPC ...
125 / ; 125 / ; 125 14 ; 83 22 ; 83152 ; 83458 ; 83460 ; 83462 ; 83465 ; 269 21 ; 269 43 ; 269 75 ; 269269 ;
Abstract
Method and apparatus for cutting a cylindrical material formed of silicone or the like which is an original material to produce semiconductor devices, using a rotary blade. In the cutting method, the base end side of the cylindrical material is fixed and at the same time, before the cutting of the cylindrical material is started, the cutting side of the cylindrical material is also fixed according to the shape thereof. The cutting is performed while maintaining such fixed conditions until the cutting is completed.