The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 1990
Filed:
Jun. 15, 1988
Applicant:
Inventors:
Tsuyoshi Aoki, Kawasaki, JP;
Michio Ono, Kawasaki, JP;
Kazuhiro Maeda, Kawasaki, JP;
Hiroyuki Kitasako, Sendai, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 70 ; 357 74 ; 357 75 ;
Abstract
A resin-molded semiconductor device applying an insulation plate unit mounted on a metal die-stage of a metal lead-frame. On the insulating plate unit, an integrated circuit semiconductor chips or a plurality of integrated circuit semiconductor chips are mounted and a plurality of relay-pads for relaying wire bonding connection between the semiconductor chip or chips and inner leads of the lead-frame are formed and arranged so as to correspond to the inner-leads, for electrically insulating the semiconductor chip or chips and the relay-pads from the metal die-stage.