Method of making a reticulated temperature sensitive imaging device

Abstract

A fully reticulated pyroelectric imager is made by affixing a first major surface of a layer of poled pyroelectric material to a substrate and polishing a second major surface of the pyroelectric layer to reduce the layer to a predetermined thickness. An electrically conductive electrode layer is deposited on the second major surface of the pyroelectric layer and portions of the electrode layer are selectively removed to define a two dimensional array of front side electrodes on the pyroelectric layer. Portions of the pyroelectric layer are then selectively removed to define a two dimensional array of pyroelectric detector elements on the substrate, with one of the front side electrodes on the second major surface of each detector element. A polymer layer is deposited over the arrays of front side electrodes and detector elements and a portion of the polymer layer is selectively removing over each front side electrode to create a via to each front side electrode. A two dimensional array of electrically conductive pads is deposited on the polymer layer such that each pad contacts a front side electrode through the corresponding via. The detector element array is mated to a multiplexer chip by connecting each pad on the detector array to circuitry on the multiplexer chip and the substrate is removed. An electrically conductive radiation absorbing layer is then deposited on the first major surface of each pyroelectric detector element.