The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 1990
Filed:
Dec. 17, 1987
Applicant:
Inventors:
Hans E Dietsch, Essex, VT (US);
William J Nestork, Hinesburg, VT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 74 ; 357 79 ; 357 80 ; 357 81 ;
Abstract
A full wafer packing technique for semiconductor devices is provided. The semiconductor wafer is mounted on a substrate wherein the coefficient of thermal expansion of the substrate is matched to that of the wafer. The wafer is also provided with at least one bus member extending across the surface of the wafer to provide voltage power to the devices. Further, the packaging includes a cover, and a solid dielectric thermally conducting material which is disposed between and the wafer and substrate and fills the space between the cover and wafer and substrate.