Wafer retention device

Abstract

A wafer retention arrangement is disclosed for use with wafer stripping machines and the like which include a housing and a turret rotatably coupled to the housing for rotation about a selected axis, the turret being formed with a plurality of pockets that are adapted to retain a wafer. The wafer retention arrangement for each pocket includes a plurality of clips disposed about the periphery of the pocket to support a retained wafer. A latching mechanism cooperates with the support means to hold the wafer within the pocket. The latching mechanism is pivotally mounted to the turret for rotation about an axis that is substantially parallel to the surface of a wafer held within its associated pocket. The pivot point about which the latch mechanism rotates is substantially adjacent the edge of the wafer but spaced apart from the wafer plane. The latch mechanism includes a cam follower portion for engaging the actuator, a wafer engaging portion for pressing against the side of a wafer carried by the associated pocket, and biasing means for urging the cam follower towards the engagement position. The clips and the latching mechanism cooperate to hold wafers of various sizes. An actuator mechanisms carried by the housing is arranged to independently pivot the latching arrangement from an engagement position suitable for contacting a wafer carried by its associated pocket to a disengaged position free from contacting the wafer.