The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 1990

Filed:

Jan. 23, 1989
Applicant:
Inventors:

David J Byerly, Lawrenceville, GA (US);

Paul S Frates, Lawrenceville, GA (US);

Charles H Scholl, Duluth, GA (US);

Assignee:

Nordson Corporation, Westlake, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B67D / ;
U.S. Cl.
CPC ...
222 49 ; 222108 ; 2221465 ; 222256 ; 222327 ;
Abstract

An apparatus for melting and dispensing rapidly degradable reactive adhesive such as moisture curable hot melt adhesive from a thermally conductive, sealed container includes a housing within which the container is supported in a position to engage a heated surface of a platen. The platen is mounted within the housing in fluid communication with a heated manifold carrying a gear pump. The platen melts the adhesive within the container and provides for the transfer of heat uniformly throughout the stream of melted adhesive discharged through the outlet of the container. The melted adhesive is transmitted from the platen into the gear pump in the manifold which is thermally isolated from the platen to maintain the adhesive therein at a substantially constant temperature. After the container is emptied, a drippage collection structure associated with the container support is pivoted beneath the outlet of the container to catch any residual adhesive and prevent spillage which might occur in the course of removing an empty container from the housing.


Find Patent Forward Citations

Loading…